Chemistry and physics of the post-exposure bake process in a chemically amplified resist

Microlithography World

Volumn 9, Issue 2, 2000, Pages

  Hinsberg, William ^a   Hoffnagle, John ^a   Houle, Frances ^a  

^a IBM ALMADEN RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACIDS; ACTIVATION ENERGY; CATALYSTS; CHEMICAL OPERATIONS; COMPUTER SIMULATION; DIFFUSION; MASS SPECTROMETRY; NUCLEAR MAGNETIC RESONANCE; PLASTIC FILMS; REACTION KINETICS; THERMAL EFFECTS;

CHEMICALLY AMPLIFIED RESIST; IMAGE SPREADING; POST EXPOSURE BAKE PROCESS;

PHOTORESISTS;

EID: 0034156652     PISSN: 1074407X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (8)