Fabrication of Spindt-type tungsten microtip field emitter arrays with optimized aluminum parting layers

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 18, Issue 2, 2000, Pages 989-993

  Park, Y J ^a   Choi, J H ^a   Lee, H W ^a   Lee, N S ^a   Kim, J W ^a   Hong, S S ^a   Park, N S ^a   Jung, J E ^a   Kim, J M ^a  

^a Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; MOLYBDENUM; MORPHOLOGY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; REACTIVE ION ETCHING; SCANNING ELECTRON MICROSCOPY; STRESS RELAXATION; SUBSTRATES; SURFACE ROUGHNESS; TRANSMISSION ELECTRON MICROSCOPY; TUNGSTEN; X RAY DIFFRACTION ANALYSIS;

ALUMINUM PARTING LAYERS; MICROTIP FIELD EMITTER ARRAYS; PEELING-FREE PROCESSES; SPINDT-TYPE FIELD EMITTER ARRAYS;

FIELD EMISSION CATHODES;

EID: 0034155930     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.591313     Document Type: Article

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