Stamp technology for fabrication of field emitter from organic material

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 18, Issue 2, 2000, Pages 877-879

  Baba, Akiyoshi ^a   Hizukuri, Masafumi ^a   Iwamoto, Masakazu ^a   Asano, Tanemasa ^a  

^a KYUSHU INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRON EMISSION; ION BOMBARDMENT; PLASTIC FILMS; PLASTICS MOLDING; POLYIMIDES; SEMICONDUCTING ORGANIC COMPOUNDS; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; TRANSFER MOLDING;

FIELD EMITTER ARRAYS (FEA); STAMP TECHNOLOGY;

FIELD EMISSION CATHODES;

EID: 0034155842     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.591290     Document Type: Article

References (8)

1. T. Asano, IEEE Trans. Electron Devices 38, 2392 (1991).
2. C. A. Spint, J. Appl. Phys. 7, 3504 (1968).
3. K. Betsui, Tech. Digest of the 4th International Vacuum Microelectronics Conference, Nagahama, 1991, p. 26 (unpublished).
4. H. F. Gray and J. L. Show, Tech. Dig. Int. Electron Devices Meet., p. 221 (1991).
5. M. Nakamoto, T. Ono, Y. Nakamura, and K. Ichimura, Proceedings of the 7th International Vacuum Microelectronics Conference, Grenoble, 1994, p. 41 (unpublished).
6. T. Asano, E. Shibata, D. Sasaguri, K. Makihira, and K. Higa, Jpn. J. Appl. Phys., Part 2 36, L818 (1997).
7. T. Asano, D. Sasaguri, E. Shibata, and K. Higa, Jpn. J. Appl. Phys., Part 1 36, 7749 (1997).
8. A. Baba, K. Higa, and T. Asano, Jpn. J. Appl. Phys., Part 2 38, L261 (1999).