Stress and displacement fields for propagating the crack along the interface of dissimilar orthotropic materials under dynamic mode I and II load

Journal of Applied Mechanics, Transactions ASME

Volumn 67, Issue 1, 2000, Pages 223-228

  Lee, K H ^a  

^a Kyungpook National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

DISSIMILAR MATERIALS; DYNAMIC LOADS; INTERFACES (MATERIALS); STRESS ANALYSIS; STRESS INTENSITY FACTORS;

DISPLACEMENT FIELDS; ORTHOTROPIC MATERIALS;

CRACK PROPAGATION;

EID: 0034155626     PISSN: 00218936     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.321171     Document Type: Article

References (5)

1. Yang, W., Suo, Z., and Shih, C. F., 1991, "Mechanics of Dynamic Debonding," Proc. R. Soc. London, Ser. A, 433, pp. 679-697.
2. Deng, X., 1993, "General Crack-Tip Fields for Stationary and Steadily Growing Interface Cracks in Anisotropic Bimaterials," J. Appl. Mech., 60, pp. 183-189.
3. Liu, C., Lambros, J., and Rosakis, A. J., 1993, "Highly Transient Elastodynamic Crack Growth in a Bimaterial Interface: Higher Order Asymptotic Analysis and Optical Experiments," J. Mech. Phys. Solids, 41, No. 12, pp. 1887-1954.
4. II, and Dynamic Crack Propagation Characteristics of Orthotropic Material," Eng. Fracl. Mech., 53, No. 1, pp. 119-140.
5. Lekhnitskii, S. G., 1963, Theory of Elasticity of an Anisotropic Elastic Body, Holden-Day, San Francisco.