Study of wetters in nickel electroforming of 3D microstructures

Materials Chemistry and Physics

Volumn 63, Issue 3, 2000, Pages 235-239

  Wei, Zen Jei ^a   Wang, Yung Yun ^a   Wan, Chi Chao ^a   Huang, Chein Ho ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b SOOCHOW UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; CURRENT DENSITY; ELECTRODEPOSITION; ELECTROLYTES; ESTERS; HARDNESS; MICROSTRUCTURE; NICKEL; ORGANIC ACIDS; POLYMETHYL METHACRYLATES; RESIDUAL STRESSES; WETTING;

SODIUM SULFOSUCCINIC ACID; WETTERS;

ELECTROFORMING;

EID: 0034148924     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0254-0584(99)00228-X     Document Type: Article

References (10)

1. A. Maner, S. Harsch, W. Ehrfeld, in: Proc. AESF SUR/FIN 1987, Session K.
2. S. Harsch, D. Münchmeyer, H. Reinecke, in: Proc. AESF SUR/FIN 1991, p. 449.
3. Huang C.H., Wu H.M., Hon Y.H. Plating Surf. Finish. 77:1990;56.
4. P. Rai-Choudhury, Microlithography, Micromachining and Microfabrication, SPIE Press, Washington, 1997, p. 99.
5. L.I. Osipow, Surface Chemistry, Robert E. Krieger Co., Huntington, NY, 1972, p. 151.
6. Prapaitrakul W., Shwikhat A., King A.D. Jr. J. Colloid Interface Sci. 115:1987;443.
7. K. Parker, AESF SUR/FIN 1984, Session B.
8. Huang C.H. Water Res. 29(8):1995;1821.
9. G. Maks, D. Blesssington, AESF SUR/FIN, 1991, p. 231.
10. Aroyo M. Plating Surf. Finish. 85:1998;69.