Encapsulation of phase change materials for storage of high temperature waste heat

High Temperature Materials and Processes

Volumn 19, Issue 3, 2000, Pages 219-222

  Akiyama, Tomohiro ^a   Yagi, Jun Ichiro ^b  

^a SENDAI NATIONAL COLLEGE OF TECHNOLOGY   (Japan)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ENCAPSULATION; HEAT STORAGE; MELTING; NICKEL PLATING; WASTE HEAT UTILIZATION;

PHASE CHANGE MATERIALS (PCM);

ELECTROPLATING;

EID: 0033902472     PISSN: 03346455     EISSN: None     Source Type: Journal    
DOI: 10.1515/HTMP.2000.19.3-4.219     Document Type: Article

References (8)

1. G.A. Adebiyi, Trans. ASME, J. Sol. Energy Eng., 113, 146 (1991)
2. D.E. Beasley, C. Ramanarayanan, H. Torab, Int. J. Energy Res., 13, 253 (1989)
3. T. Saitoh and K. Hirose, Trans.J.Soc.Mech.Eng., 51B, 1867 (1985)
4. L.C.C. Goncalves and S.D. Probert, Appl. Energy, 45, 117 (1993).
5. K. Vafai and M. Sozen, Trans. ASME, J. Heat Transf., 112, 1014 (1990).
6. T. Akiyama, Y. Ashizawa and J. Yagi, Heat Transfer Japanese Research, 21, 199-217 (1992).
7. T. Akiyama, H. Nogami, R. Takahashi and J. Yagi, Experimental Heat Transfer, Fluid Mechanics and Thermodynamics, 2, 1530 (1993)
8. T. Akiyama, T. Fukutani, R. Takahashi, J. Yagi, H. Ohta and Y. Waseda, AIChE J., 41, 1349 (1995).