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Volumn 76, Issue 12, 2000, Pages 1804-1810
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Dielectric characterization of relaxation and curing behavior of oriental lacquer
a a b |
Author keywords
[No Author keywords available]
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Indexed keywords
ATMOSPHERIC HUMIDITY;
CURING;
DIELECTRIC RELAXATION;
GLASS TRANSITION;
STRUCTURE (COMPOSITION);
TEMPERATURE;
THERMAL EFFECTS;
THERMODYNAMIC PROPERTIES;
COLE-COLE PLOTS;
DIELECTRIC ANALYSIS;
DIELECTRIC RELAXATION INTENSITY;
SECONDARY RELAXATION TEMPERATURE;
LACQUERS;
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EID: 0033902162
PISSN: 00218995
EISSN: None
Source Type: Journal
DOI: 10.1002/(SICI)1097-4628(20000620)76:12<1804::AID-APP11>3.0.CO;2-4 Document Type: Article |
Times cited : (3)
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References (19)
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