Thin-wall back extrusion of partially remelted semi-solid Sn-Pb

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 31, Issue 1, 2000, Pages 57-62

  Basner, T ^a   Pehlke, R ^b   Sachdev, A ^c  

^a DELPHI CORPORATION   (United States)

^b GENERAL MOTORS CORPORATION   (United States)

^c UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; METAL EXTRUSION; REMELTING; RHEOLOGY; SHEAR STRESS;

BACK EXTRUSION TECHNIQUE; TIN LEAD ALLOYS;

TIN ALLOYS;

EID: 0033896440     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-000-0052-z     Document Type: Article

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