Codeposition of hydrophilic and hydrophobic silica with copper from acid copper sulfate baths

Journal of the Electrochemical Society

Volumn 147, Issue 1, 2000, Pages 198-202

  Terzieva, V ^a,b   Fransaer, J ^b   Celis, J P ^b  

^a UNIVERSITY OF SOFIA   (Bulgaria)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

AMMONIUM COMPOUNDS; COMPOSITE MATERIALS; COPPER COMPOUNDS; CURRENT DENSITY; ELECTRODEPOSITION; HYDROPHOBICITY; PROTECTIVE COATINGS; SILICA; SILICONES; SODIUM COMPOUNDS; SURFACE ACTIVE AGENTS;

ACID COPPER SULFATE; CETYL TRIMETHYL AMMONIUM HYDROGEN SULFATE; OLIGODIMETHYL SILOXANE DIOL; SODIUM DODECANE SULFONATE; STOBER PROCESS;

ELECTROCHEMICAL ELECTRODES;

EID: 0033895933     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1393174     Document Type: Article

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