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Volumn 77, Issue 7, 2000, Pages 332-335
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Curing exotherm and processing temperature of a family of epoxy resins in the light of fabrication of composites
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Author keywords
[No Author keywords available]
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Indexed keywords
ACRYLAMIDE DERIVATIVE;
EPOXY RESIN;
ARTICLE;
CHEMICAL REACTION;
CHEMICAL STRUCTURE;
DIFFERENTIAL SCANNING CALORIMETRY;
ENTHALPY;
REACTION ANALYSIS;
SYNTHESIS;
TEMPERATURE;
THERMODYNAMICS;
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EID: 0033894552
PISSN: 00194522
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
Times cited : (3)
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References (15)
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