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Volumn 77, Issue 7, 2000, Pages 332-335

Curing exotherm and processing temperature of a family of epoxy resins in the light of fabrication of composites

Author keywords

[No Author keywords available]

Indexed keywords

ACRYLAMIDE DERIVATIVE; EPOXY RESIN;

EID: 0033894552     PISSN: 00194522     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (3)

References (15)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.