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Volumn 86, Issue 1, 2000, Pages 38-44

Effect of S content in deposit on low-cycle fatigue properties of Ni film electroplated from sulfamate baths

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATING; FATIGUE OF MATERIALS; GRAIN BOUNDARIES; METALLIC FILMS; SULFUR; TENSILE TESTING;

EID: 0033887271     PISSN: 00211575     EISSN: None     Source Type: Journal    
DOI: 10.2355/tetsutohagane1955.86.1_38     Document Type: Article
Times cited : (8)

References (20)
  • 3
    • 0011127991 scopus 로고
    • INCO Ltd., New York
    • Nickel Electroforming, INCO Ltd., New York, (1991), 12.
    • (1991) Nickel Electroforming , pp. 12
  • 11
    • 85037964329 scopus 로고    scopus 로고
    • Japanese source
  • 17
    • 85037966804 scopus 로고    scopus 로고
    • Japanese source


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.