Copper: emerging material for wire bond assembly

Solid State Technology

Volumn 43, Issue 4, 2000, Pages 71-72,-74,-77

  Ellis, Timothy W ^a   Levine, Lee ^a   Wicen, Rudy ^a  

^a Kulicke & Soffa Industries ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COPPER; COST BENEFIT ANALYSIS; ELECTROMIGRATION; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT MANUFACTURE; METALLIZING; OXIDATION; SHEAR STRENGTH; SURFACE TREATMENT;

ALUMINUM WAFER METALLIZATION; COPPER BALL BONDING; COPPER WAFER METALLIZATION; COPPER WIRE BONDING; WIRE BOND ASSEMBLY;

ELECTRONICS PACKAGING;

EID: 0033886627     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (11)