Residual stress studies in graded W/Cu materials by neutron diffraction method

Physica B: Condensed Matter

Volumn 276-278, Issue , 2000, Pages 884-885

  Bokuchava, G D ^a   Schreiber, J ^b   Shamsutdinov, N ^a   Stalder, M ^b  

^a JOINT INSTITUTE FOR NUCLEAR RESEARCH   (Russian Federation)

^b FRAUNHOFER INSTITUTE FOR NON DESTRUCTIVE TESTING   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; COMPUTER SIMULATION; COPPER; ELECTRIC CONDUCTANCE; MATHEMATICAL MODELS; NEUTRON DIFFRACTION; RESIDUAL STRESSES; STRESS ANALYSIS; THERMAL CONDUCTIVITY; THERMAL EXPANSION; TUNGSTEN;

HEAT EXPANSION COEFFICIENTS;

COMPOSITE MATERIALS;

EID: 0033884604     PISSN: 09214526     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-4526(99)01276-4     Document Type: Article

References (2)

1. Aksenov V.et al. Proc. of ICANS-XII. 1:1993;124.
2. R. Jedamzik et al., Proceedings of the 14th International Plansee Sem. 1 (1997) 1.