Novel blister test to investigate thin film delamination at elevated temperature

International Journal of Adhesion and Adhesives

Volumn 20, Issue 2, 2000, Pages 141-143

  Wan, Kai Tak ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COATINGS; DELAMINATION; INTERFACES (MATERIALS); THIN FILMS;

BLISTER TEST;

ADHESION;

EID: 0033882580     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0143-7496(99)00031-7     Document Type: Article

References (4)

1. Williams M.L. J Appl Polym Sci. 13:1969;29.
2. Bennet S.J., Devries K.L., Williams M.L. Int J Fracture. 10:1974;33.
3. Wan K.-T., Mai Y.-W. Acta Metall Mater. 43:1995;4109.
4. Wan K.-T., Breach C.D. J Adhesion. 66:1998;183.