Fabrication, microstructure and stress effects in sputtered TiNi thin films

Materials Science Forum

Volumn 327, Issue , 2000, Pages 295-302

  Grummon, D S ^a  

^a Michigan State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTALLIZATION; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; REACTION KINETICS; RESIDUAL STRESSES; SOLIDIFICATION; SPUTTER DEPOSITION; STRESS RELAXATION; TERNARY SYSTEMS; THIN FILMS; TITANIUM ALLOYS;

EQUIATOMIC TERNARY ALLOYS; TRANSFORMATIONAL SUPERELASTICITY;

SHAPE MEMORY EFFECT;

EID: 0033881809     PISSN: 02555476     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.4028/www.scientific.net/msf.327-328.295     Document Type: Article

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4. D. S. Grummon, Li Hou and T. J. Pence, J. de Physique IV, C8 pp 665-670 (1995).
5. Li Hou, T. J. Pence and D. S. Grummon, Mat. Res. Soc. Proc. 360, pp 369-374 (1995).
6. K.i Nomura and S. Miyazaki, Proc. 1995 N. Amer. Conf. On Smart Structures and Materials (1995).
7. Shuichi Miyazaki, Takanori Hashinaga, Kazuya Yumikura, Hiroshi Horikawa, Tatsuhiko Ueki and Akira Ishida, Proc. 1995 North American Conf. On Smart Structures and Materials, (1995).