Laser induced Cu/alumina bonding: Microstructure and bond mechanism

Surface and Coatings Technology

Volumn 125, Issue 1-3, 2000, Pages 40-44

  Shepeleva, L ^a   Medres, B ^a   Kaplan, W D ^a   Bamberger, M ^a   McCay, M H ^b   McCay, T D ^b   Sharp, M ^b  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

^b UNIVERSITY OF TENNESSEE SPACE INSTITUTE   (United States)

Author keywords

Alumina; Copper cladding; Laser treatment; Microstructure

Indexed keywords

ALUMINA; BONDING; CERAMIC MATERIALS; CLADDING (COATING); COPPER; COPPER COMPOUNDS; GRAIN BOUNDARIES; LASER APPLICATIONS; MICROSTRUCTURE; SURFACE TREATMENT;

LASER TREATMENT;

PROTECTIVE COATINGS;

EID: 0033881604     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(99)00602-7     Document Type: Article

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