High-temperature cyclic fatigue-crack growth behavior in an in situ toughened silicon carbide

Acta Materialia

Volumn 48, Issue 3, 2000, Pages 659-674

  Chen, D ^a   Gilbert, C J ^a   Zhang, X F ^a   Ritchie, R O ^a  

^a Lawrence Berkeley National Laboratory   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; CRACK PROPAGATION; CREEP; FATIGUE TESTING; FRACTOGRAPHY; FRACTURE MECHANICS; FRACTURE TOUGHNESS; GRAIN BOUNDARIES; HIGH TEMPERATURE EFFECTS; LOAD TESTING; STRESS INTENSITY FACTORS;

GRAIN BRIDGING;

SILICON CARBIDE;

EID: 0033878959     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(99)00406-1     Document Type: Article

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