Toxicity and worldwide environmental regulation of lead-free solders

Transactions of the Institute of Metal Finishing

Volumn 78, Issue 2, 2000, Pages

  Smith, Edwin B ^a   Kristine Swanger, L ^a  

^a KTEC Electronics   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENVIRONMENTAL IMPACT; ENVIRONMENTAL PROTECTION; GROUNDWATER POLLUTION; HAZARDOUS MATERIALS; LAND FILL; LAWS AND LEGISLATION; LEACHING; TIN ALLOYS; TOXICITY;

LEAD-FREE SOLDERS;

SOLDERING ALLOYS;

EID: 0033878601     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)

1. Surface Mount Technology, 12 (12) (December 1998), 40.
2. IPC Review, October 1998, l
3. Material from this section taken from the papers presented at the lead free soldering forum at IPC PC EXPO'99, Long Beach, California; March 1999. Papers were authored by Smith, Felty, Shibata, and Tanner