Enhancement of barrier properties in chemical vapor deposited TiN employing multi-stacked Ti/TiN structure

Japanese Journal of Applied Physics, Part 2: Letters

Volumn 39, Issue 2 A, 2000, Pages

  Chang, Ting Chang ^a,c   Liu, Po Tsun ^b   Yang, Ya Liang ^c   Hu, Jung Chih ^d   Sze, Simon M ^b,c  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^c NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

^d NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; CHLORINE; DIFFUSION IN SOLIDS; ELECTRIC CONDUCTIVITY OF SOLIDS; GRAIN BOUNDARIES; LEAKAGE CURRENTS; SECONDARY ION MASS SPECTROMETRY; TITANIUM; TITANIUM NITRIDE;

DIFFUSION BARRIER FILMS;

PROTECTIVE COATINGS;

EID: 0033877377     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.39.L82     Document Type: Article

References (17)