On cellular spacing selection of Cu-Mn alloy under ultra-high temperature gradient and rapid solidification condition

Scripta Materialia

Volumn 42, Issue 6, 2000, Pages 543-548

  Yang, Sen ^a   Huang, Weidong ^a   Lin, Xin ^a   Su, Yunpeng ^a   Zhou, Yaohe ^a  

^a NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL GROWTH; CRYSTAL MICROSTRUCTURE; HIGH TEMPERATURE EFFECTS; MATHEMATICAL MODELS; RAPID SOLIDIFICATION; REMELTING;

CELLULAR SPACING; COPPER MANGANESE ALLOYS; ULTRAHIGH TEMPERATURE GRADIENT;

COPPER ALLOYS;

EID: 0033876210     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(99)00395-4     Document Type: Article

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