Silicon-on-insulator: Materials aspects and applications

Solid-State Electronics

Volumn 44, Issue 5, 2000, Pages 775-782

  Plößl, Andreas ^a,b   Kräuter, Gertrud ^a  

^a MAX PLANCK INSTITUTE OF MICROSTRUCTURE PHYSICS   (Germany)

^b OSRAM OPTO SEMICONDUCTORS GMBH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ION IMPLANTATION; SILICON WAFERS;

WAFER DIRECT BONDING TECHNIQUES;

SILICON ON INSULATOR TECHNOLOGY;

EID: 0033875710     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0038-1101(99)00273-7     Document Type: Article

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