Modeling the curing kinetics for a modified bismaleimide resin

Journal of Polymer Science, Part A: Polymer Chemistry

Volumn 38, Issue 5, 2000, Pages 907-913

  Boey, Freddy Y C ^a   Song, X L ^a   Yue, C Y ^a   Zhao, Q ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b Beijing Aeronautical Manufacturing Technology Research Institute   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CATALYSIS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; MATHEMATICAL MODELS; REACTION KINETICS; RESINS;

BISMALEIMIDE RESIN; ISOTHERMAL SCAN METHOD;

POLYIMIDES;

EID: 0033875029     PISSN: 0887624X     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1099-0518(20000301)38:5<907::AID-POLA15>3.0.CO;2-F     Document Type: Article

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