|
Volumn 210, Issue 1, 2000, Pages 351-355
|
Application of the narrow spectral range InAs-FPA-based IR camera for the investigation of the interface voids in silicon wafer bonding
|
Author keywords
[No Author keywords available]
|
Indexed keywords
ANNEALING;
BUBBLES (IN FLUIDS);
CAMERAS;
CRYSTAL DEFECTS;
INSPECTION;
LIGHT REFLECTION;
LIGHT TRANSMISSION;
QUALITY CONTROL;
SEMICONDUCTING INDIUM COMPOUNDS;
SILICON ON INSULATOR TECHNOLOGY;
THERMOGRAPHY (IMAGING);
FOCAL PLANE ARRAY (FPA);
INDIUM ARSENIDE;
SILICON WAFERS;
|
EID: 0033873517
PISSN: 00220248
EISSN: None
Source Type: Journal
DOI: 10.1016/S0022-0248(99)00709-5 Document Type: Article |
Times cited : (12)
|
References (11)
|