Thermal behavior of solder bonded and adhesive bonded folded fin assemblies

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2000, Pages 33-41

  Loh, C K ^a   Chou, Bor Bin ^a   Nelson, Dan ^a   Chou, D J ^a  

^a Enertron Inc ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINS (HEAT EXCHANGE); HEAT RESISTANCE; MICROPROCESSOR CHIPS; SOLDERING;

ELECTRONICS THERMAL SYSTEM DESIGN;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0033750706     PISSN: 10652221     EISSN: None     Source Type: Journal    
DOI: 10.1109/STHERM.2000.837059     Document Type: Article

References (1)

1. J. P. Holman Heat Transfer 8th 1997 McGraw-Hill, Inc. New York Conduction-Convection Systems