Modeling of elastic and thermophysical properties of MMC heat sinks with given orientation distribution of the fibers

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2000, Pages 235-242

  Pettermann, H E ^a  

^a ARC SEIBERSDORF RESEARCH GMBH   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MICROMECHANICS; COPPER; HEAT SINKS; METALLIC MATRIX COMPOSITES; THERMAL CONDUCTIVITY OF SOLIDS;

MORI-TANAKA APPROACH;

ELECTRONICS PACKAGING;

EID: 0033750702     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (12)