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Volumn 3952, Issue , 2000, Pages 410-417
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Self-aligned laser-fiber coupling using tin/gold (20/80) solder on micro-optical silicon benches
a a a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRONICS PACKAGING;
ELECTROOPTICAL DEVICES;
EUTECTICS;
FIBER LASERS;
FLIP CHIP DEVICES;
INTEGRATED OPTOELECTRONICS;
REACTIVE ION ETCHING;
SILICON;
SOLDERING ALLOYS;
TIN ALLOYS;
SELF-ALIGNED LASER-FIBER COUPLING;
OPTICAL FIBER COUPLING;
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EID: 0033750464
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (2)
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References (7)
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