Polyurethane adhesives for electronic devices

Journal of Adhesion Science and Technology

Volumn 14, Issue 7, 2000, Pages 915-924

  Figovsky, Oleg L ^a   Sklyarsky, Leonid S ^a   Sklyarsky, Olga N ^a  

^a Polymate Ltd   (Israel)

Author keywords

Adhesives; Corrosion activity; Electronic devices; Polydiene urethanes

Indexed keywords

ATMOSPHERIC HUMIDITY; DIELECTRIC PROPERTIES; ELASTICITY; ELECTRONICS PACKAGING; POLYURETHANES; PRINTED CIRCUIT BOARDS; RELIABILITY; TEMPERATURE; ADHESIVES; ESTERS; MECHANICAL PROPERTIES;

POLYURETHANE ADHESIVE; RELIABILITY TEST; CORROSION ACTIVITY; DIELECTRIC CHARACTERISTICS; ELECTRICAL RESISTANCE CHANGE; ELECTRONIC COMPONENT; ELECTRONIC DEVICE; ELECTRONIC DEVICES; ELECTRONIC PACKAGING; HIGH TEMPERATURE; MECHANICAL AND DIELECTRIC PROPERTIES; PERFORMANCE PARAMETERS; POLYDIENE URETHANES; POLYURETHANE ADHESIVES; URETHANE ADHESIVES;

PLASTIC ADHESIVES; THERMOELECTRIC EQUIPMENT;

EID: 0033750159     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856100742979     Document Type: Article

References (10)

1. A. J. Kinloch, Adhesion and Adhesives. Science and Technology. Chapman & Hall, London (1987).
2. J. R. Harrison and R. N. Boyd, Organic Chemistry, 3rd edn, pp. 675-684. Allyn and Bacon, Boston (1973).
3. P. Rozdzial, Technologia Hermetyzacji Sprzetu Electronicznego. Wydawnictwa Naukowo-Techniczne, Warsaw (1976).
4. O. Figovsky, L. Shapovalov and N. Blank, Proceedings of the International Conference on Corrosion, Vol. 2, pp. 757-763. Mumbai, India(1997).
5. D. V. Dahringer, Appl. Polym. Symp. 19, 371-378(1972).
6. E.-J. Gerard and J. K. L. Schneider, Proceedings of the Polyurethanes World Congress'97, Amsterdam, pp. 552-559. Technomic Publishing, Lancaster, PA (1997).
7. J. A. Verdol, P. W. Ryan, D. J. Carrow and K. L. Kuncl, Rubber Age 98 (7), 57-65; 98 (8), 62-68(1966).
8. L. Sklyarsky and O. Figovsky, US Patent 5880203 (1999).
9. S. L. Huang, S. J. Yu and J. Y. Lai, J. Adhesion Sci. Technol. 12, 445-456 (1998).
10. R.M. Houghton and D. A. Williamson, SPE J. 27 (9), 43-46 (1977).