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Volumn , Issue , 2000, Pages 60-67
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Thermal analysis of an electronics enclosure: Coupling Flow Network Modeling (FNM) and Computational Fluid Dynamics (CFD)
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Author keywords
[No Author keywords available]
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Indexed keywords
BOUNDARY CONDITIONS;
COMPUTATIONAL FLUID DYNAMICS;
MATHEMATICAL MODELS;
SEMICONDUCTOR DEVICE MANUFACTURE;
THERMAL EFFECTS;
FLOW NETWORK MODELING (FNM);
ELECTRONICS PACKAGING;
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EID: 0033742660
PISSN: 10652221
EISSN: None
Source Type: Journal
DOI: 10.1109/STHERM.2000.837062 Document Type: Article |
Times cited : (21)
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References (10)
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