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Volumn , Issue , 2000, Pages 60-67

Thermal analysis of an electronics enclosure: Coupling Flow Network Modeling (FNM) and Computational Fluid Dynamics (CFD)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COMPUTATIONAL FLUID DYNAMICS; MATHEMATICAL MODELS; SEMICONDUCTOR DEVICE MANUFACTURE; THERMAL EFFECTS;

EID: 0033742660     PISSN: 10652221     EISSN: None     Source Type: Journal    
DOI: 10.1109/STHERM.2000.837062     Document Type: Article
Times cited : (21)

References (10)
  • 1
    • 0004152278 scopus 로고
    • Thermal Computations for Electronic Equipment
    • Robert E. Krieger Publishing Co. Florida, Malibar
    • G.N Ellison Thermal Computations for Electronic Equipment 1989 Robert E. Krieger Publishing Co. Florida, Malibar
    • (1989)
    • Ellison, G.N1
  • 2
    • 0001847603 scopus 로고    scopus 로고
    • Improving Productivity in Electronics Packaging with Flow Network Modeling (FNM)
    • C. Belady K. M. Kelkar S. V. Patankar Improving Productivity in Electronics Packaging with Flow Network Modeling (FNM) Electronics Cooling 5 1 36 40 January 1999
    • (1999) Electronics Cooling , vol.5 , Issue.1 , pp. 36-40
    • Belady, C.1    Kelkar, K.M.2    Patankar, S.V.3
  • 3
    • 85177131978 scopus 로고    scopus 로고
    • Use of Flow Network Modeling (FNM) for the Design of Air-Cooled Servers
    • R. Steinbrecher A. Radmehr K. M. Kelkar S. V. Patankar Use of Flow Network Modeling (FNM) for the Design of Air-Cooled Servers Advances in Electronics Packaging, Proceedings of the Pacific RIM/ASME Intersociety Electronics and Photonic Packaging Conference II 1999 2008 Advances in Electronics Packaging, Proceedings of the Pacific RIM/ASME Intersociety Electronics and Photonic Packaging Conference 1999
    • (1999) , vol.II , pp. 1999-2008
    • Steinbrecher, R.1    Radmehr, A.2    Kelkar, K.M.3    Patankar, S.V.4
  • 4
    • 0040530969 scopus 로고    scopus 로고
    • Use of Flow Network Modeling (FNM) for enhancing the design process of Electronic Cooling Systems
    • K. M. Kelkar A. Radmehr P. Kelly S.V. Patankar C. Belady Use of Flow Network Modeling (FNM) for enhancing the design process of Electronic Cooling Systems Proc. International Systems Packaging Symposium (ISPS) 58 63 Proc. International Systems Packaging Symposium (ISPS) San Diego 1999-January-11-13
    • (1999) , pp. 58-63
    • Kelkar, K.M.1    Radmehr, A.2    Kelly, P.3    Patankar, S.V.4    Belady, C.5
  • 5
    • 0032660385 scopus 로고    scopus 로고
    • Analysis of the Effect of Bypass on the Performance of Heat Sinks Using Flow Network Modeling (FNM)
    • A. Radmehr K. M. Kelkar P. Kelly S. V. Patankar S. S. Kang Analysis of the Effect of Bypass on the Performance of Heat Sinks Using Flow Network Modeling (FNM) Proc. Semiconductor Thermal Measurement and Management Symposium (SEMITHERM) 42 47 Proc. Semiconductor Thermal Measurement and Management Symposium (SEMITHERM) San Diego 1999-March-9-11
    • (1999) , pp. 42-47
    • Radmehr, A.1    Kelkar, K.M.2    Kelly, P.3    Patankar, S.V.4    Kang, S.S.5
  • 6
    • 85177141084 scopus 로고    scopus 로고
  • 7
    • 85177115275 scopus 로고    scopus 로고
    • Compact User's Manual Innovative Research, Inc.
  • 8
    • 85177141825 scopus 로고
    • MacroFlow User's Manual 1980 Innovative Research, Inc.
    • (1980)
  • 9
    • 0003444442 scopus 로고
    • Handbook of Hydraulic Resistance
    • CRC Press Florida
    • I. E. Idelchik Handbook of Hydraulic Resistance 1994 CRC Press Florida
    • (1994)
    • Idelchik, I.E.1
  • 10
    • 0004726712 scopus 로고
    • Fluid Dynamics Handbook
    • Krieger Publishing Company
    • R.D Blevins Fluid Dynamics Handbook 1992 Krieger Publishing Company
    • (1992)
    • Blevins, R.D1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.