Integrated GaAs Schottky mixers by spin-on-dielectric wafer bonding

IEEE Transactions on Electron Devices

Volumn 47, Issue 6, 2000, Pages 1152-1157

  Marazita, Steven M ^a,b,c   Bishop, William L ^a,b,c   Hesler, Jeffrey L ^a,b,c   Hui, Kai ^a,b,c   Bowen, Willie E ^a,b,c   Crowe, Thomas W ^a,b,c  

^a University of Virginia   (United States)

^b Virginia Millimeter Wave Inc   (United States)

^c IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BONDING; COMPUTER SIMULATION; CURING; DIELECTRIC MATERIALS; INTEGRATED CIRCUIT LAYOUT; MILLIMETER WAVE DEVICES; MIXER CIRCUITS; OHMIC CONTACTS; SEMICONDUCTING GALLIUM ARSENIDE; SUBSTRATES;

DOUBLE SIDEBAND MIXER; INTEGRATED MIXER; QUARTZ UPSIDE DOWN INTEGRATED DEVICE; SPIN ON DIELECTRIC WAFER BONDING; SUBMILLIMETER WAVE DEVICE;

SCHOTTKY BARRIER DIODES;

EID: 0033739983     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/16.842956     Document Type: Article

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