Quantitative thermal probing of devices at sub-100 nm resolution

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2000, Pages 394-398

  Shi, Li ^a   Kwon, Ohmyoung ^a   Wu, Guanghua ^a   Majumdar, Arunava ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CURRENTS; HEATING; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT TESTING; MICROSCOPIC EXAMINATION; PROBES; THERMOANALYSIS;

SCANNING THERMAL MICROSCOPY (STHM);

VLSI CIRCUITS;

EID: 0033733051     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (8)