Monitoring plasma impedance match characteristics in a multipole inductively coupled plasma for process control

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 18, Issue 1, 2000, Pages 58-62

  Kim, Byungwhan ^a  

^a Chonnam National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC POWER SYSTEMS; IMPEDANCE MATCHING (ELECTRIC); MAGNETIC CORES; PLASMA DIAGNOSTICS; PLASMA ETCHING; PROCESS CONTROL; REAL TIME SYSTEMS; SENSITIVITY ANALYSIS; SENSORS; STATISTICAL METHODS;

LOW PRESSURE PLANAR PLASMA; MULTIPLE INDUCTIVELY COUPLED PLASMA; PLASMA IMPEDANCE MATCH;

PLASMAS;

EID: 0033726475     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.582117     Document Type: Article

References (3)

1. A. J. Miranda and C. J. Spanos, J. Vac. Sci. Technol. A 14, 1888 (1996).
2. J. Ogle et al., U.S. Patent No. 5,435,881.
3. J. Ogle (private communication).