Applications of speckle metrology to vibration and deformation measurements of electronic

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2000, Pages 253-255

  Jin, G C ^a   Yao, X F ^a   Bao, N K ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CORRELATION METHODS; DEFORMATION; INTERFEROMETRY; MICROELECTRONICS; OPTICAL INSTRUMENT LENSES; OPTICAL SYSTEMS; SPECKLE; SPURIOUS SIGNAL NOISE; THERMAL VARIABLES MEASUREMENT; VIBRATION MEASUREMENT; WAVELET TRANSFORMS;

CROSS SEARCH METHOD; DIGITAL SPECKLE CORRELATION; ELECTRONIC SPECKLE PATTERN INTERFEROMETRY; SPECKLE METROLOGY; THERMAL DEFORMATION; WAVELET NOISE REDUCTION;

INTEGRATED CIRCUIT TESTING;

EID: 0033724615     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (5)