Improved TMAH Si-etching solution without attacking exposed aluminum

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2000, Pages 562-567

  Yan, Gui zhen ^a   Chan, Philip C H ^a   Hsing, I Ming ^a   Sharma, Rajnish K ^a   Sin, Johnny K O ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; AMMONIUM COMPOUNDS; ETCHING; PROTECTIVE COATINGS; SEMICONDUCTING SILICON;

TETRAMETHYL AMMONIUM HYDROXIDE;

MICROELECTROMECHANICAL DEVICES;

EID: 0033724550     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (7)