Investigation of arcing effects during contact blow open process

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 2, 2000, Pages 271-277

  Zhou, Xin ^a   Theisen, Peter ^a  

^a EATON CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC ARCS; ELECTRIC CONTACTS; HEAT CONDUCTION; MAGNETIC FIELDS; MATHEMATICAL MODELS; SHORT CIRCUIT CURRENTS; WELDS;

ARC PRESSURE; CONSTRICTION FORCE; CONTACT BLOW OPEN PROCESS; CONTACT SPRING FORCE;

ELECTRONICS PACKAGING;

EID: 0033723930     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.846764     Document Type: Article

References (12)

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