Effects of dispersed microvoids on thermal expansion behavior of composite materials

Materials Science and Engineering: A

Volumn 285, Issue 1-2, 2000, Pages 99-110

  Hatta, Hiroshi ^a   Takei, Takako ^b   Taya, Minoru ^c  

^a JAPAN AEROSPACE EXPLORATION AGENCY   (Japan)

^b MITSUBISHI ELECTRIC CORPORATION   (Japan)

^c University of Washington   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRESS; ELASTIC MODULI; MATHEMATICAL MODELS; STRESS ANALYSIS; THERMAL EXPANSION; VOLUME FRACTION;

COEFFICIENT OF THERMAL EXPANSIONS (CTE); PARTICULATE COMPOSITES;

FIBER REINFORCED MATERIALS;

EID: 0033723509     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0921-5093(00)00721-8     Document Type: Article

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