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Volumn 78, Issue 4, 2000, Pages 143-146
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Surface finishes for advanced PWBS using COB, BGA, CSP and fine pitch SMDS
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Author keywords
[No Author keywords available]
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Indexed keywords
BONDING;
ELECTRONICS PACKAGING;
FINISHING;
GOLD;
NICKEL;
PALLADIUM;
SOLDERED JOINTS;
SOLDERING;
TIN;
BALL GRID ARRAYS (BGA);
CHIP ON BOARD (COB);
CHIP SCALE PACKAGES (CSP);
PRINTED CIRCUIT BOARDS;
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EID: 0033722413
PISSN: 00202967
EISSN: None
Source Type: Journal
DOI: 10.1080/00202967.2000.11871327 Document Type: Article |
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Times cited : (1)
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References (0)
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