Increase in capacitance and tan δ between conductors on printed circuit board at low frequency due to ionic migration

IEEE Transactions on Dielectrics and Electrical Insulation

Volumn 7, Issue 3, 2000, Pages 366-373

  Yamano, Y ^a   Tsukui, T ^b  

^a CHIBA UNIVERSITY   (Japan)

^b TOKAI UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; CONDUCTIVE MATERIALS; COPPER; ELECTRIC RESISTANCE; ELECTROMIGRATION; IONIC CONDUCTION IN SOLIDS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT TESTING;

IONIC MIGRATION;

ELECTRIC INSULATING MATERIALS;

EID: 0033721364     PISSN: 10709878     EISSN: None     Source Type: Journal    
DOI: 10.1109/94.848918     Document Type: Article

References (12)

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3. Investigation Committee on High Reliability on Printed Wiring Board, Technical Report on Insulating Reliability of Printed Wiring Board; Especially on Endurance to Ionic Migration, IEEJ Technical Report, IEEJ, Tokyo, No. 615, 1996.
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8. JEC-6150-1991, Methods of Test for permittivity and Dielectric Dissipation Factor of Electrical Insulating Materials, IEEJ, 1991. (Standard: Japanese Electric Committee).
9. J. P. Mitchell and T. L. Welsher, "Conductive Anodic Filament Growth in Printed Circuit Materials", Proceedings of the Printed Circuit World Convention II, pp. 42-55, 1981.
10. T. Hanai, Film and Ion: Theory and Calculation of Transport, Kagakudoujin Inc., Kyoto, 1980. Chapter 1.
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