Ultra CSPTM bump on polymer structure

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2000, Pages 211-215

  Yang, Hong ^a   Elenius, Peter ^a   Barrett, Scott ^a  

^a Flip Chip Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DYNAMIC RANDOM ACCESS STORAGE; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUIT TESTING; SOLDERED JOINTS; THERMAL CYCLING;

CHIP SCALE PACKAGES (CSP);

MICROPROCESSOR CHIPS;

EID: 0033718476     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)