Fabrication and packaging of optical components and microsystems

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4075, Issue , 2000, Pages 140-149

  Rantala, Juha T ^a   Aikio, Janne ^a   Karioja, Pentti ^a   Descour, Michael R ^a   Kopola, Harri ^a   Lammasniemi, Jorma ^a  

^a VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; ELECTRONICS PACKAGING; FABRY-PEROT INTERFEROMETERS; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT MANUFACTURE; LITHOGRAPHY; OPTICAL COMMUNICATION; OPTICAL SENSORS; SEMICONDUCTING GLASS; SEMICONDUCTOR DEVICE STRUCTURES; SEMICONDUCTOR LASERS; SILICON ON INSULATOR TECHNOLOGY;

LIQUID PHASE DEPOSITION; MICROOPTICAL COMPONENTS; MICROOPTOELECTROMECHANICAL SYSTEMS; SYSTEM ON CHIP;

INTEGRATED OPTOELECTRONICS;

EID: 0033712416     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)