Novel low impedance line for MMIC using air-gap stacked structure

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 2000, Pages 613-616

  Ryu, Gi Hyon ^a   Kim, Dae Hyun ^a   Lee, Jae Hak ^a   Seo, Kwang Seo,k ^a  

^a Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AIR GAP STACKED STRUCTURE; DIELECTRIC LAYER;

CAPACITANCE; ELECTRIC FIELD EFFECTS; HIGH ELECTRON MOBILITY TRANSISTORS; IMPEDANCE MATCHING (ELECTRIC); MICROSTRIP LINES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; POWER AMPLIFIERS; SEMICONDUCTING GALLIUM ARSENIDE; SUBSTRATES;

TRANSMISSION LINE THEORY;

EID: 0033710068     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (4)

1. T. Tokumitsy T. Hiraoka, H. Nakamoto, and T. Takenaka, "Multilayer MMIC using a 3um X 3-Iayer dielectric film structure", 1990 IEEE MTT-S Digest, pp 831-834.
2. T. Hiraoka, T. Tokumitsu, and M. Aikawa, "Very small wide-band MMlC magic two-stage balanced Ku-band Ts using microstrip lines on a thin dielectric film", IEEE Trans. Microwave Theory Tech., vol. MTT-37, pp1569-1575, Oct. 1989
3. G. -H. Ryu, D. -H. Kim, J. -H. Lee, and K. -S. Seo, "A novel 3 dB coupler for MMIC using air-gap stacked microstrip lines", will be published in the January 2000 issue of IEEE Microwave Guided Wave Lett.
4. 4 dielectric layers", IEEE Microwave Guided Wave Lett. vo1.9, no. 9, pp. 345-347, Sep. 1999.