Numerical study of interfacial delamination in a system-on-package (SOP) integrated substrate under thermal loading

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2000, Pages 356-361

  Xie, Weidong ^a   Sitaraman, Suresh K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DELAMINATION; DIELECTRIC MATERIALS; FINITE ELEMENT METHOD; INTERFACIAL ENERGY; MULTILAYERS; NUMERICAL METHODS; SUBSTRATES; THERMAL EFFECTS; THERMAL LOAD; THIN FILM DEVICES;

ENERGY RELEASE RATE; INTEGRATED SUBSTRATE; INTERFACIAL DELAMINATION; MULTILAYERED STRUCTURE; SYSTEM ON PACKAGE; THIN FILM PASSIVE COMPONENT;

ELECTRONICS PACKAGING;

EID: 0033709086     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (14)