Experimental study on performance of a miniature heat pipe with woven-wired wick

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2000, Pages 129-133

  Moon, Seok Hwan ^a   Choi, Choon Gi ^a   Hwang, Gunn ^a   Choy, Tae Goo ^a  

^a Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; ELECTRONIC EQUIPMENT; HEAT SINKS; HEAT TRANSFER; PRESSURE; THERMAL LOAD;

MINIATURE HEAT PIPES; OPERATING FACTORS; THERMAL DENSITY; WICK STRUCTURE; WOVEN WIRED WICK;

HEAT PIPES;

EID: 0033709084     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (8)