Novel method of cooling electronic packages using a porous channel heat sink subjected to oscillating flow

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2000, Pages 162-168

  Fu, H L ^a   Leong, K C ^a   Huang, X Y ^a   Liu, C Y ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CHANNEL FLOW; ELECTRONICS PACKAGING; HEAT SINKS; HEAT TRANSFER COEFFICIENTS; NUSSELT NUMBER; OSCILLATIONS; POROUS MATERIALS; REYNOLDS NUMBER; STEADY FLOW; TEMPERATURE DISTRIBUTION; TEMPERATURE MEASUREMENT; VISCOSITY;

ELECTRONIC COOLING; OSCILLATING FLOW; POROUS CHANNEL;

COOLING;

EID: 0033708944     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (12)