Novel fabrication method for 3-D microstructures using surface-activated bonding of thin films

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2000, Pages 574-579

  Yamada, Takayuki ^a   Takahashi, Mutsuya ^a  

^a FUJI XEROX CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; BONDING; DIELECTRIC FILMS; METALLIC FILMS; MICROSTRUCTURE; PHOTOLITHOGRAPHY; THIN FILMS;

SURFACE-ACTIVATED BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 0033708595     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)