Influence of W2B5 addition on microstructure and thermoelectric properties of B4C ceramic

Ceramics International

Volumn 26, Issue 5, 2000, Pages 523-527

  Cai, Ke Feng ^a   Nan, Ce Wen ^a  

^a WUHAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; CERAMIC MATERIALS; COMPOSITION EFFECTS; CRYSTAL MICROSTRUCTURE; ELECTRIC CONDUCTIVITY MEASUREMENT; SEEBECK EFFECT; THERMAL CONDUCTIVITY; THERMAL EFFECTS; TUNGSTEN COMPOUNDS;

TUNGSTEN BORIDE;

BORON CARBIDE;

EID: 0033707276     PISSN: 02728842     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0272-8842(99)00089-9     Document Type: Article

References (8)

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3. Hurvits G., Rosenbaum R., McLachlan D.S. A quantitative analysis of the thermoelectric power measurements on composite Al-Ge films. J. Appl. Phys. 73(11):1993;7441-7445.
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7. 5 without pressing. J. Mater. Sci. Lett. 7:1988;695-696.
8. ASTM Specification C373, ASTM Standards part 13, American Society for Testing and Materials, Philadelphia, 1969.