Electromigration test structure designed to identify via failure modes

IEEE International Conference on Microelectronic Test Structures

Volumn , Issue , 2000, Pages 155-157

  Sriram, T S ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RESISTANCE MEASUREMENT; ELECTROMIGRATION; FAILURE ANALYSIS; RELIABILITY; TRANSMISSION ELECTRON MICROSCOPY;

ELECTROMIGRATION TEST STRUCTURE; FOCUSED ION BEAM;

INTEGRATED CIRCUIT TESTING;

EID: 0033706674     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)