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Volumn 558, Issue , 2000, Pages 387-392
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Jet printing of copper lines at 200°C maximum process temperature
a
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Author keywords
[No Author keywords available]
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Indexed keywords
AMORPHOUS SILICON;
ELECTRIC CONTACTS;
GLASS;
LASER APPLICATIONS;
MASKS;
METALLIZING;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
SEMICONDUCTOR DEVICE STRUCTURES;
TEMPERATURE;
THIN FILM TRANSISTORS;
COPPER LINES;
DRAIN CONTACTS;
JET PRINTING;
LASER PRINTED TONER ETCH MASKS;
COPPER;
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EID: 0033706403
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (4)
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References (13)
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