Buckling and fracture of thin films under compression

Key Engineering Materials

Volumn 183, Issue , 2000, Pages

  Cotterell, B ^a   Chen, Z ^a  

^a INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BUCKLING; COMPACTION; DELAMINATION; FRACTURE; POLYETHYLENE TEREPHTHALATES; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INDIUM COMPOUNDS; STIFFNESS;

COMPLIANT SUBSTRATE; INDIUM TIN OXIDE; STEADY STATE TENSION CRACKING;

THIN FILMS;

EID: 0033706289     PISSN: 10139826     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

1. M.D. Thouless, J. Amer. Ceram. Soc., 76 (1993) p. 2936.
2. H.M. Jensen, Acta Metall. Mater., 41 (1993) p. 601.
3. J.W. Hutchinson and Z. Suo, Advances in Applied Mechanics, 29 (1991) p. 63.
4. J. Dundars, J. Appl. Mech.., 36 (1969) p. 650.
5. M.D. Thouless, J.W. Hutchinson, and E.G. Linger, Acta Metall. Mater., 40 (1992) p. 2639.
6. R.G. Stringfellow and L.B. Freund, Int. J. Solids Struct., 30 (1993) p. 1379.