New ultra-thin 3D integration technique: Technological and thermal investigations

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4019, Issue , 2000, Pages 324-332

  Pinel, Stephane ^a   Tassellii, Josiane ^a   Marty, Antoine ^a   Bailbe, Jean Pierre ^a   Beyne, Eric ^a   Van Hoof, Rita ^a   Marco, Santiago ^a   Leseduarte, Sergio ^a   Vendier, Olivier ^a   Coello Vera, Augustin ^a  

^a LAAS CNRS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

AROMATIC HYDROCARBONS; BUTENES; COMPUTER SIMULATION; ELECTRONICS PACKAGING; GLUES; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT MANUFACTURE; LIGHT SENSITIVE MATERIALS; MULTICHIP MODULES; SILICON WAFERS; WSI CIRCUITS;

ULTRATHIN CHIP STACK (UTCS) TECHNOLOGY;

MICROPROCESSOR CHIPS;

EID: 0033705387     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)