Design and analysis of across chip linewidth variation for printed features at 130 nm and below

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3998, Issue , 2000, Pages 168-177

  Chen, J Fung ^a   Socha, Robert J ^a   Puntambekar, Kumar ^a   Wampler, Kurt E ^a   Caldwell, Roger ^a   Dusa, Mircea V ^a   Love, John C ^a   Yeric, Greg ^a   Stoner, Brenda ^a  

^a ASML US Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ERROR ANALYSIS; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT TESTING; MASKS; MICROPROCESSOR CHIPS;

ACROSS-CHIP LINEWIDTH VARIATION (ACLV); CRITICAL DIMENSIONS (CD); MASK ERROR FACTORS (MEF); MASK PATTERN DENSITY;

LITHOGRAPHY;

EID: 0033704440     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)